Company Profile

公司简介

Ingchips was set up in Sept. 2017, Zhangjiagang, Jiangsu Province. We have finished the first-round funding around 20M RMB at the beginning of 2018, and the investors are famous VCs in IC industry.

The founder and the team are from famous leading IC companies such as NXP, ST, Ericsson, RDA, Marvell, etc. The core members all have 10+ yeares experience in mixed signal SoC products, totally 20+ successful mass production records.

We are capable of all the IC frontend and backend flows, and expertise coving different technology nodes from 180nm to 28nm at TSMC and SMIC, etc .  


Ingchips technology is targeting to be a leading enterprise in the Wireless MCU Fabless chip design house in intelligent hardware and low-power IoT industry.

The current project is a low power BT5 SoC chip based on fully self-designed intellectual property rights, as well as low power Bluetooth 5.1 audio SoC chip.

The intermediate target is providing other categories of IoT wireless terminal SoC chips and solutions, including NB-IoT, etc. The medium and long-term goals of the enterprise are to become the leading IoT chipset provider and the solution vendor of intelligent IoT devices.



Full Own IP implement of Bluetooth 5

Strong RD team of SoC



Competitive Product Portfolios



Growing Market of IoT Industry


Mission

我们的使命

Patents

产品专利

86-10-52780085

market@ingchips.com

Tower B Room 607, Century Science and Trade Building ZhongGuanCun East Road, Haidian District, Beijing, China

Building D Room 402-403,Zhangjiagang Economic and 

Technological Development Zone,
(Zhangjiagang high technology entrepreneurship Service 
Center)

Jiangsu Province,China





INGCHIPS